International Scientific Journals
of Scientific Technical Union of Mechanical Engineering "Industry 4.0"

Diamond is currently one of the main reserves for the development of microelectronics. It is with it that tangible progress of this industry is possible, allowing it to reach new technical frontiers, associated primarily with an increase in the speed and power of electronic components. Of the many laser technologies for processing materials in the production of electronic components, the following processes are distinguished: cutting, ablation and welding. For short and ultra-short laser pulse durations, the above processes are applicable under certain conditions, e.g., the thickness and linear size of the element are mainly in the micrometer range. High accuracy of part processing is achieved by using the size of the laser spot on the surface > 0.5 μm and a power density of about 109 W/cm2. This can be realized by increasing the uniformity of the laser beam, controlling the pulse shape, and selecting the wavelength of the laser radiation. Laser ablation, especially on metal structures, is implemented using nano-, pico- and femptosecond pulses. If the laser power density values are much higher than the threshold for ablation, treatment occurs at 120 fs < tp <150 fs using wavelengths of 800 and 1064 nm. The features of laser ablation in metals, semiconductors, and dielectrics are to reduce the threshold power flux density if the pulse duration is reduced from nano- to femtoseconds. The main promising areas of predominant application of diamond and diamond-containing materials in the production of components of electronic equipment are presented.