• MATHEMATICAL MODELLING OF TECHNOLOGICAL PROCESSES AND SYSTEMS

    Study of binary liquid capillary bridges stretched between two solid flat surfaces

    Mathematical Modeling, Vol. 6 (2022), Issue 1, pg(s) 13-16

    Liquid capillary bridges (CBs), created between two flat solid surfaces, parallel to each other, are of significant importance for number of scientific and industrial applications. In this paper, we present our experimental investigation of the liquid CBs at stretching, created by two immiscible liquids: cedar oil–water and paraffin-water with common interface. The behaviour of these binary structures was studied and compared with that of the single liquid CBs. It was found that the binary liquid CBs exist in the same definition domain as the single liquid CBs. Moreover, the current paper is focused not only on static, but also on non-equilibrium behaviour of CBs. We demonstrate that the binary liquid CBs can be engineered by the proper combination of polar (water) and non-polar (oil) fluids and these CBs exist within the theoretically predicted domain. The experimental results of water/cedar oil and water/paraffin binary CBs shows that the paraffin spreads in water surface and modifies the overall surface tension of the system, while the cedar oil and water retain their surface properties within the binary structure.

  • MATERIALS

    Investigation of solders surface tension in temperature range from melting point up to 673К

    Machines. Technologies. Materials., Vol. 15 (2021), Issue 2, pg(s) 69-72

    Solders are fusible metal alloys, used in industry to create permanent bond between metal surfaces. In order to achieve this, solders need to be heated above their melting point and used in liquid phase. Low melting temperature is essential from technological point of view, as well as for soldered components safety. Typical solders have Lead (Pb) аs а base component, having melting temperature of 600.6 K. Adding up to 60% of Tin (Sn) to the alloy, reduces melting temperature down to 456-461 K in average. Since 2006, RoHS regulation enforce industrial use of Lead-Free solders, typically having much higher melting temperature. However, Pb:Sn solders with up to 40% Sn still have their industrial applications, usually used for soldering Cu and Zn coated pipes while the 60% Sn containing solders are used for soldering of
    electrical cables.
    The achieving of these goals requires knowledge of liquid phase surface tension. Because of the difficulties, related to such measurement, the available data in literature are limited. The current report presents an equipment for measurement of the surface tension, based on the Wilhelmy plate method as well as the applied measurement procedure. The Wilhelmy method has relatively good stability. The contact angle also can be considered zero for the examined samples therefore correction coefficients are not required for the measurement. The results from measurement of Pb:Sn in ratio 40:60 and also in ratio 60:40 show that the oxidation in excess of Pb lowers the surface tension while for the case with excess of Sn, the oxidation lead to increase of the surface tension if compare with the surface tension obtained for the same solders but under non-oxidizing conditions. This could be attributed to formation in excess of PbO and SnO on the liquid surface of the corresponding solder