International Scientific Journals
of Scientific Technical Union of Mechanical Engineering "Industry 4.0"

This work is devoted to the study of the stage of galvanic copper plating of through-holes in multilayer printed circuit boards. Hole plating is one of the most difficult stages and requires high-tech electrolytes and equipment. The present study was carried out within the framework of the development of a domestic electrolyte for copper plating of PCB holes and is devoted to the study of the effect of the nature and concentration of brightening additives on the gloss of a copper coating.

The process of deposition of titanium, zirconium-containing coatings at aluminum alloy 5556 is developed. In the process of performing the work, the basic patterns of coating formation were identified. The solution composition and process parameters were optimized, and the physicochemical properties were investigated. It is shown that passivation of aluminum alloy 5556 in a titanium,zirconium-containing solution increases its corrosion resistance to pitting corrosion. These coatings can replace chromate coatings because of good ability to resist corrosion.