SPECKLE PATTERN INTERFEROMETRY FOR MEASUREMENT OF RESIDUAL STRESS: BASIC APPROACH, MATHEMATICAL SUPPORT, SPECIAL ARRANGEMENT, PRACTICAL APPLICATION
Machines. Technologies. Materials., Vol. 9 (2015), Issue 5, pg(s) 18-20
The paper provides a comprehensive description of theoretical and practical aspects of electronic speckle pattern interferometry for technological residual stress measurement in various machine elements. Any results obtained by investigation of residual stress in a welded joint are presented.