Modern copper electrolyte holes for multi-layer printed curcuit boards

  • 1 Department of Innovative Materials and Corrosion Protection – Mendeleev University of Chemical Technology Moscow, Russian Federation


This work is devoted to the study of the stage of galvanic copper plating of through-holes in multilayer printed circuit boards. Hole plating is one of the most difficult stages and requires high-tech electrolytes and equipment. The present study was carried out within the framework of the development of a domestic electrolyte for copper plating of PCB holes and is devoted to the study of the effect of the nature and concentration of brightening additives on the gloss of a copper coating.



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