Reliability evaluation of electronic component in military vehicles under thermal exposure and thermal cycling by accelerated test method

  • 1 Faculty of Military Technology, University of Defence, Brno, Czech Republic
  • 2 University of Fire Fighting and Prevention, Hanoi, Vietnam


The majority of electronic components are susceptible to damage at high temperatures (overheating) and their reliability is affected by its operating temperature. The temperature can basically dictate the effective performance as well as the lifetime or life cycle of the electronic components. In addition, the reliability of electronic components is not only affected temperatures but also by changes in temperature over a period of time (thermal cycles). This article describes the methodology how to prepare, perform and evaluate the accelerated reliability compliance test of electronic components in military vehicles under thermal exposure and thermal cycling.


  1. KOLEKTIV. Military Vetronics Association. MILVA Vetronics handbook, NATO-LG/3, Brusel, 2006.
  2. P. V. Varde. Physics-of-failure based approach for predicting life and reliability of electronics components. Barc Newsletter, 313 (2010).
  3. L.M. Klyatis, E. Klyatis. Accelerated quality and reliability solutions. Elsevier, 2010.
  4. S. U. M. Rao. Influence of environmental factors on component/equipment reliability. Indian Journal of Engineering & Materials Sciences, 5 (1998).
  5. G. Yang. Life cycle reliability engineering. New Jersey, Wiley, 10 (2007).
  6. JESD22-A104E. Temperature Cycling. JEDEC solid state technology association, 2009, 18 p.
  7. MIL-STD-883F. Test method standard microcircuits. Washington: US Department of Defense, 1997, 641 p.
  8. IEC 62506. Methods for product accelerated testing. IEC, 2013, 88 p.
  9. F. Bayle, A. Metta. Temperature acceleration models in reliability predictions: Justification & improvements. Proceedings-Annual Reliability and Maintainability Symposium (RAMS). IEEE, 2010.
  10. M. H. Chang, et al. Light emitting diodes reliability review. Microelectronics Reliability, 5 (2012).
  11. IEC 60605-4. Equipment reliability testing - Part 4: Statistical procedures for exponential distribution – Point estimates, confidence intervals, prediction intervals and tolerance intervals. IEC, 2001.

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