Machines. Technologies. Materials.
Vol. 15 (2021), Issue 4, pg(s) 144-145

TECHNOLOGIES

Conditioning and etching of the surface of printed circuit boards holes prior to metallization

  • 1 Department of Innovative Materials and Corrosion Protection – Mendeleev University of Chemical Technology Moscow, Russian Federation

Abstract

This work is devoted to the study of solutions for the stages of cleaning-conditioning and micro-etching before chemical copper plating of printed circuit board (PCB) holes. It has been shown that in the presence of a quaternary amine in the conditionin g solution, the negatively charged initial surface of the PCB holes is recharged. This, apparently, promotes the subsequent electrostatic adsorption of negatively charged colloidal particles of palladium activator in the holes of the PCB. It was revealed that the presence of copper ions in the micro-etching solution leads to an increase in the surface roughness, which contributes to an increase in the adhesion strength of the resulting metal layer to the dielectric.

Keywords

References

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