International Scientific Journals
of Scientific Technical Union of Mechanical Engineering "Industry 4.0"

In the production of integrated circuit packages, the process of laser monopulse thermal strengthening with beams of special geometry has been researched, developed and implemented to increase the durability of dies for the production of flanges, injection molds, housing rim calibration dies, and automatic stamps for the production of integrated circuits. Laser pulse hardening modes for stamp parts and injection molds have been established. A necessary condition is the presence of a laser emitter, which, according to its technical parameters, allows one to obtain a pulse energy sufficient for thermal strengthening of the contour of the working edges of the part. In order to prevent undesirable effects on the working edges of technological tool parts, a theoretical model of the hardening process has been developed, which allows for the calculation and optimization of laser processing modes to obtain the required operational properties of steel based on a preliminary calculation of temperature fields.