The paper deal with heat pipe technology which is often used in electronic cooling from small voltage microchips to the high voltage electric elements. In case of cooling the high voltage electric elements have to be evaporator part and condenser part of heat pipe a separated by electrical nonconductive material, because the heat pipes are most often made of metallic materials, and thus, are electrically conductive. As a working fluids in this applications are used dielectric fluids such as fluorinert liquids. But there is still risk of the dielectric breakdown between evaporator and condenser of heat pipe. The task of the experiment is to find how the ambient temperature effect on dielectric breakdown of vapour phase of working fluid in heat pipe. In experiment was investigated dielectric breakdown between copper pipes inserted in to glass heat pipe in distance of 70 and 65 mm and temperature range -10 to -40°C. This distance simulate electric insulator distance of heat pipe used for real application of high voltage electric element cooling. For this experiment was used glass heat pipe with working fluid Fluorinert FC 72. The choice of this fluid is mainly due its excellent dielectric properties and unique combination of the thermodynamic and others properties, which makes the Fluorinert FC – 72 ideal fluid for electronic cooling used in many electronic applications.