International Scientific Journals
of Scientific Technical Union of Mechanical Engineering "Industry 4.0"

This work is devoted to the study of the stage of galvanic copper plating of through-holes in multilayer printed circuit boards. Hole plating is one of the most difficult stages and requires high-tech electrolytes and equipment. The present study was carried out within the framework of the development of a domestic electrolyte for copper plating of PCB holes and is devoted to the study of the effect of the nature and concentration of brightening additives on the gloss of a copper coating.