PECULIARITIES OF METALIZED SURFACES MODIFICATION OF SILICON ELEMENTS OF MICROELECTROMECHANICAL SYSTEMS WITH LOW-POWER ELECTRONIC FLOW
- 1 Faculty of Electronically Technologies, Cherkassy State Technological University, Ukraine
- 2 Faculty of instrument-making, National Technical University of Ukraine «Ihor Sikorsky Kyiv Polytechnic Institute», Ukraine
- 3 Department of International Relations, Cherkassy State Technological University, Ukraine
- 4 Faculty of Information Technologies and Systems, Cherkassy State Technological University, Ukraine
The practical possibility of the atomic force microscopy method to evaluate uniformity of thin metal coatings on silicon wafers after electronic processing has been shown in the paper. It is established that after processing of metallized surfaces of silicon plates Kp0 by an electronic flow of continuous form, the microroughness decreases in 10-15 times and the Adhesive strength increases in 1.8-2 times. At the same time, it is noted that the surface of metal coatings on silicon after electronic processing has a more homogeneous structure and released from microdefects, unlike metallized coatings without electronic processing.